AMTECH NC-559-V2-TF No-clean Tacky Solder Flux with UV-Tracer (ROL0) - 10g
NC-559-V2-TF is a no-clean tacky solder flux designed with a sole purpose – hand-soldering with tin-lead (Sn/Pb) alloys. Very successful formula with a distinct pine scent and many devoted consumers worldwide. A golden standard for manual leaded rework. Most popular formulation among electronics repair shops and soldering enthusiasts.
– ROL0 flux classification
– Standard solder flux for Tin/Lead applications
– Clear residue easily evaporates by hot air – less viscous and easier to clean with IPA (compared to NC-559-ASM-TF)
– High temperature compatible
– Excellent wetting compatibility on most board finishes
– Highly praised by Advanced Reworks Community – doesn’t short components
– Wide process window – continue where you left off
- Rosin-based, low activity no-clean tacky solder flux specifically designed for hand-operations with leaded alloys - manual Sn/Pb rework. Suitable for any level of training, with any basic, readily available amateur soldering tools. Fills the workspace with distinctive pleasant pine scent - has been a prime choice for electronics and automotive repair industry for two decades.
- Mighty action - a noticeable booster for copper ions while wicking the workspace. High temp - quickly breaks-up lead-free joints for further leaded repair without losing properties (up to 300°C/600°F). Exceptional wetting - tames tin/lead alloy, puts an operator in control. Excellent tackiness - holds components in-place allowing for an easy repositioning using technics like "dancing" a component with hot air. Long process window - continue a project at a later time, once heated the flux will flow again.
- Optimal viscosity - 36-48 (Malcom @ 10 RPM/25°C (x103mPa/s)) allowing smooth flow from a syringe. Halide-free (<0.05%). Surface insulation (SIR) resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop). Loaded with fire-retardant properties step-activated as heat increases - soldering Sn10/Pb88/Ag2 is no different from Sn63/Pb37 although alloys operate within 100°C range difference.
- ROL0 classification - non-corrosive, doesn't short components, can be left on board for multiple SMT assemblies (manufacturer recommends cleaning all flux residues at all times to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from air and subsequently cause corrosion). Clear residue can be easily removed with hot air, foam swab and basic solvents like isopropanol.
- Industrial air-syringe intended for professional use with pneumatic dispensing machines - to manually control the flow use a third party plunger and dispensing tip (not supplied with the flux). Do not remove the piston/stopper! Do not discard original nozzle cap, tighten the cap while not using the flux - flux may dry out upon extended contact with air. Keep at a room temperature - do not refrigerate. Genuine product made in the USA by AMTECH MANUFACTURING LLC, every original shipment includes AMTECH Soldering Profiles card.
– ROL0 flux classification
– Standard solder flux for Tin/Lead applications
– Clear residue easily evaporates by hot air – less viscous and easier to clean with IPA (compared to NC-559-ASM-TF)
– High temperature compatible
– Excellent wetting compatibility on most board finishes
– Highly praised by Advanced Reworks Community – doesn’t short components
– Wide process window – continue where you left off
- Rosin-based, low activity no-clean tacky solder flux specifically designed for hand-operations with leaded alloys - manual Sn/Pb rework. Suitable for any level of training, with any basic, readily available amateur soldering tools. Fills the workspace with distinctive pleasant pine scent - has been a prime choice for electronics and automotive repair industry for two decades.
- Mighty action - a noticeable booster for copper ions while wicking the workspace. High temp - quickly breaks-up lead-free joints for further leaded repair without losing properties (up to 300°C/600°F). Exceptional wetting - tames tin/lead alloy, puts an operator in control. Excellent tackiness - holds components in-place allowing for an easy repositioning using technics like "dancing" a component with hot air. Long process window - continue a project at a later time, once heated the flux will flow again.
- Optimal viscosity - 36-48 (Malcom @ 10 RPM/25°C (x103mPa/s)) allowing smooth flow from a syringe. Halide-free (<0.05%). Surface insulation (SIR) resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop). Loaded with fire-retardant properties step-activated as heat increases - soldering Sn10/Pb88/Ag2 is no different from Sn63/Pb37 although alloys operate within 100°C range difference.
- ROL0 classification - non-corrosive, doesn't short components, can be left on board for multiple SMT assemblies (manufacturer recommends cleaning all flux residues at all times to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from air and subsequently cause corrosion). Clear residue can be easily removed with hot air, foam swab and basic solvents like isopropanol.
- Industrial air-syringe intended for professional use with pneumatic dispensing machines - to manually control the flow use a third party plunger and dispensing tip (not supplied with the flux). Do not remove the piston/stopper! Do not discard original nozzle cap, tighten the cap while not using the flux - flux may dry out upon extended contact with air. Keep at a room temperature - do not refrigerate. Genuine product made in the USA by AMTECH MANUFACTURING LLC, every original shipment includes AMTECH Soldering Profiles card.
